3-D Prismatic Packaging Methodologies for Wide Band Gap Power Electronics Modules

In a power module the parasitic inductance limits dynamic high-frequency performance, and area of cooling surfaces capability. This article presents new 3-D electronic design methodology based on concept mutual cancellation multisided heat transfer. New prismatic packaging concepts are proposed for wide band gap devices, where devices can be mounted at acute angles to adjacent interconnects or other devices. Discussion is given electrical thermal path optimization in space. To validate methodology, 1200 V/50 A SiC half-bridge fabricated tested performance results compared with simulations. The density calculated 12 kW/in 3 (including heatsink) shows 31.3% reduction 2-D planar module. Finally, guidance suggested utilizing structures provided, together future work area. first reported true